Sulfur Hexafluoride (SF6)
DESCRIPTION (Sulfur Hexafluoride):
Sulfur Hexafluoride is a colorless, non-flammable gas primarily used in semiconductor manufacturing. Sulfur hexafluoride is a fluorine source for high density plasma etching without generating carbon by-products. SF6 can be used for etching metal silicides (specially tungsten etchback), nitrides and oxides versus their metal substrates. Additional uses include as an insulating agent in high voltage electrical transformers, switches or systems, leak detection and as a replacement gas in eye surgery.
PHYSICAL CONSTANTS (Sulfur Hexafluoride):
| Molecular weight |
146.05 g/mol |
| Latent heat of fusion (14.7 psig, at triple point) |
39.75 kJ/kg |
| Liquid density (at triple point) |
1880 kg/m3 |
| Boiling point (Sublimation) |
-63.9 °C |
| Latent heat of vaporization (14692 psig at boiling point) |
162.2 kJ/kg |
| Vapor pressure (at 21 °C or 70 °F) |
311.8 psig |
| Critical temperature |
45.5 °C |
| Critical pressure |
545.2 psig |
| Triple point temperature |
-49.4 °C |
| Triple point pressure |
32.8 psig |
| Gas density (14692 psig and 15 °C (59 °F)) |
6.27 kg/m3 |
| Compressibility Factor (Z) (14692 psig and 15 °C (59 °F)) |
0.9884 |
| Specific gravity (air = 1) (14692 psig and 21 °C (70 °F)) |
5.114 |
| Specific volume (14692 psig and 21 °C (70 °F)) |
0.156 m3/kg |
| Heat capacity at constant pressure (Cp) (14692 psig and 21 °C (70 °F)) |
0.097 kJ/(mol.K) |
| Viscosity (14692 psig and 0 °C (32 °F)) |
0.000142 Poise |
| Thermal conductivity (14692 psig and 0 °C (32 °F)) |
12.058 mW/(m.K) |
| Solubility in water (20 °C and 14.5 psig) |
0.007 vol/vol |
CYLINDER CONNECTIONS
(Sulfur Hexafluoride):
Standard CGA V-1 Cylinder Connection: CGA 590
Standard CGA V-1 Cylinder Connection Ultra High Integrity: CGA 716
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